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SMD1812B050TF - Yageo Group

Description: Polymeric PTC Resettable Fuse 15V 500 mA Ih Surface Mount 1812 (4532 Metric), Concave

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Symbol
SMD1812B050TF - Yageo Group - PCB symbol
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PCB Footprints
SMD1812B050TF - Yageo Group PCB footprint - Fuses Chip - Fuses Chip - 1812 (4532 Metric)2024
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3D Models
SMD1812B050TF - Yageo Group - 3D model - Fuses Chip - 1812 (4532 Metric)2024
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SMD1812B050TF Details

  • Manufacturer Part Number:

    SMD1812B050TF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.40.80.70

  • Factory Lead Time:

    21 Weeks, 1 Day

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    8.25

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1 mm

  • Package Length:

    4.73 mm

  • Package Style:

    SMT

  • Package Width:

    3.41 mm

  • Packing Method:

    TR, 7 INCH

  • Reference Standard:

    CUL; TUV; UL

  • Resistance:

    0.15 Ω

  • Resistor Type:

    PTC RESETTABLE FUSE

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Thermistor Application:

    OVERCURRENT PROTECTION

  • Working Voltage:

    15 V

SMD1812B050TF Frequently Asked Questions (FAQs)

  • The recommended land pattern for SMD1812B050TF is a rectangular pad with a size of 2.5mm x 1.3mm, with a solder mask clearance of 0.1mm. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • SMD1812B050TF is a moisture-sensitive device (MSD) and requires special handling to prevent damage. It should be stored in a dry environment with a relative humidity of less than 30% and a temperature range of 10°C to 30°C. Before reflow soldering, the component should be baked at 125°C for 24 hours to remove any moisture.
  • The maximum reflow temperature for SMD1812B050TF is 260°C, with a peak temperature of 250°C for a maximum of 10 seconds. The component should be reflowed using a soldering profile with a ramp-up rate of 3°C/second and a cool-down rate of 6°C/second.
  • Yes, SMD1812B050TF is compatible with lead-free soldering. The component is designed to meet the requirements of RoHS (Restriction of Hazardous Substances) and is suitable for use with lead-free solder alloys such as SAC305 (96.5% Sn, 3% Ag, 0.5% Cu).
  • The typical tolerance for the resistance value of SMD1812B050TF is ±1%. This means that the actual resistance value of the component may vary by up to 1% from the nominal value of 50 ohms.

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SMD1812B050TF Overview

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