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SMLJ33CA - Bourns

Description: Bourns SMLJ33CA, Bi-Directional TVS Diode, 3000W, 2-Pin SMC

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PCB Footprints
SMLJ33CA - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMC (DO-214AB) HEIGHT 2.62
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3D Models
SMLJ33CA - Bourns  - 3D model - Diodes Moulded Non Polarised - SMC (DO-214AB) HEIGHT 2.62
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SMLJ33CA Details

  • Manufacturer Part Number:

    SMLJ33CA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC, SMC, 2 PIN

  • Pin Count:

    2

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.66

  • Breakdown Voltage-Max:

    40.6 V

  • Breakdown Voltage-Min:

    36.7 V

  • Breakdown Voltage-Nom:

    38.65 V

  • Clamping Voltage-Max:

    53.3 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    33 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SMLJ33CA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SMLJ33CA is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad.
  • Handle the SMLJ33CA by the body only, avoiding touching the leads or the glass passivation. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the component.
  • The maximum operating temperature range for the SMLJ33CA is -40°C to +150°C. However, the device can withstand storage temperatures up to +200°C for short periods of time.
  • Yes, the SMLJ33CA is suitable for high-reliability applications. It is designed and manufactured to meet the requirements of AEC-Q200, which is a standard for automotive-grade components. The device has undergone rigorous testing and qualification to ensure its reliability in harsh environments.
  • Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pad, and place the component on the board. Use a gentle touch to avoid applying excessive pressure, which can damage the component. Solder the component using a reflow oven or a hand soldering iron.

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SMLJ33CA Overview

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For a full list of alternate parts for SMLJ33CA, check out Findchips.com