Please enter a minimum 3 letters or numbers
Technical Content
Part Image

SMMBD701LT1G - onsemi

Description: High Reverse Voltage - to 70 Volts; Low Reverse Leakage - 200 nA (Max); Very Low Capacitance - 1.0 pF @ VR = 20 V; Extremely Low Minority Carrier Lifetime - 15 ps (Typ); Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Qualified and PPAP Capable

Download SMMBD701LT1G Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
Send part feedback
Symbol
SMMBD701LT1G - onsemi - PCB symbol
click to zoom
PCB Footprints
SMMBD701LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
click to zoom
3D Models
SMMBD701LT1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
click to zoom

SMMBD701LT1G Details

  • Manufacturer Part Number:

    SMMBD701LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    125 °C

  • Peak Reflow Temperature (Cel):

    260

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

SMMBD701LT1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2 oz copper thickness and a thermal via array under the package is recommended. Refer to the onsemi application note AND9393/D for more details.
  • Ensure that the device is operated within the recommended operating temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Avoid exceeding the maximum junction temperature (Tj) of 150°C.
  • The recommended soldering profile is a peak temperature of 260°C, with a dwell time of 30-60 seconds above 217°C. Refer to the onsemi application note AND9393/D for more details.
  • The SMMBD701LT1G has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is grounded.
  • Store the device in a dry, cool place, away from direct sunlight. The recommended storage temperature range is -40°C to 30°C, with a relative humidity of 60% or less.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SMMBD701LT1G Overview

Use the download button to access the SMMBD701LT1G schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SMMBD, or try a keyword search, such as Microwave Mixer Diodes

Parts related to SMMBD701LT1G

Showing 0 results

Part Image

← Prev Next →
About Us Contact Us Terms of Service Do not sell or share my personal information Privacy Policy Digital Services Act Library Loader Twitter LinkedIn

All content Copyright © 2020, Supplyframe.com. All rights reserved. Back to top ↑