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SMMBFJ175LT1G - onsemi

Description: Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Miniature SOT-23 Surface Mount Package Saves Board Space; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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SMMBFJ175LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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3D Models
SMMBFJ175LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318 ISSUE AU
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SMMBFJ175LT1G Details

  • Manufacturer Part Number:

    SMMBFJ175LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 2.90x1.30x1.00, 1.90P

  • Package Description:

    SOT-23, 3 PIN

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.21.00.95

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.5

  • Configuration:

    SINGLE

  • Drain Current-Max (ID):

    0.06 A

  • Drain-source On Resistance-Max:

    125 Ω

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    5.5 pF

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation Ambient-Max:

    0.225 W

  • Power Dissipation-Max (Abs):

    0.225 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SMMBFJ175LT1G Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SMMBFJ175LT1G is a standard SOT-23 package footprint with a minimum pad size of 0.8mm x 0.8mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure proper biasing, the SMMBFJ175LT1G requires a minimum voltage of 1.8V and a maximum voltage of 5.5V on the gate pin, and a source pin voltage that is at least 0.5V below the drain pin voltage.
  • The maximum power dissipation of the SMMBFJ175LT1G is 1.4W at a junction temperature of 150°C, assuming a thermal resistance of 125°C/W.
  • To protect the SMMBFJ175LT1G from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the device is stored in an anti-static bag or tube.
  • The recommended operating frequency range for the SMMBFJ175LT1G is up to 5GHz, although the device can operate at higher frequencies with reduced performance.

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SMMBFJ175LT1G Overview

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