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SMMBT3904TT1G - onsemi

Description: These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; Small Footprint package

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SMMBT3904TT1G Details

  • Manufacturer Part Number:

    SMMBT3904TT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    300 MHz

  • Turn-off Time-Max (toff):

    250 ns

  • Turn-on Time-Max (ton):

    70 ns

SMMBT3904TT1G Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the SMMBT3904TT1G is -55°C to 150°C.
  • To ensure stability, it's recommended to use a decoupling capacitor (e.g., 100nF) between the base and emitter, and to minimize the lead length and inductance of the base connection.
  • For optimal thermal performance, it's recommended to use a thermal pad under the transistor, and to keep the copper area as large as possible to dissipate heat. A minimum of 2 oz copper thickness is recommended.
  • Yes, the SMMBT3904TT1G can be used in switching applications, but it's essential to ensure that the transistor is operated within its safe operating area (SOA) to prevent damage. A suitable snubber circuit may be required to reduce voltage spikes.
  • To prevent electrostatic discharge (ESD) damage, it's recommended to use ESD protection devices, such as TVS diodes or ESD protection arrays, in conjunction with proper PCB design and handling practices.

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SMMBT3904TT1G Overview

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