Description:Miniature SOT-23 Surface Mount Package Saves Board Space; Low rDS(on) Provides Higher Efficiency and Extends Battery Life; Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
HALOGEN FREE AND ROHS COMPLIANT, 318-08, TO-236, 3 PIN
Pin Count:
3
Manufacturer Package Code:
318
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.21.00.75
Factory Lead Time:
10 Weeks
Date Of Intro:
1999-01-01
Manufacturer:
onsemi
YTEOL:
7
Collector Current-Max (IC):
0.6 A
Collector-Base Capacitance-Max:
8.5 pF
Collector-Emitter Voltage-Max:
40 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
100
JEDEC-95 Code:
TO-236AB
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
PNP
Power Dissipation Ambient-Max:
0.225 W
Power Dissipation-Max (Abs):
0.225 W
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
200 MHz
Turn-off Time-Max (toff):
255 ns
Turn-on Time-Max (ton):
35 ns
VCEsat-Max:
0.75 V
SMMBT4403LT1G Frequently Asked Questions (FAQs)
A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB, and to use thermal vias to dissipate heat to the other side of the board.
To ensure reliable operation at high temperatures, it is recommended to follow the recommended operating conditions, use a heat sink if necessary, and ensure good thermal conductivity between the device and the heat sink or PCB.
It is recommended to follow standard ESD protection practices, such as using ESD-sensitive handling and storage procedures, and incorporating ESD protection devices or circuits in the system design.
Yes, the SMMBT4403LT1G is qualified for automotive and high-reliability applications, but it is recommended to consult with onsemi's application engineers to ensure the device meets the specific requirements of the application.
It is recommended to follow standard soldering and assembly procedures, such as using a soldering iron with a temperature of 260°C or less, and using a solder with a melting point of 180°C or higher.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SMMBT4403LT1G Overview
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