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SMMBT5551LT1G - onsemi

Description: Miniature SOT-23 Surface Mount Package Saves Board Space; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SMMBT5551LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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3D Models
SMMBT5551LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08 ISSUE AR
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SMMBT5551LT1G Details

  • Manufacturer Part Number:

    SMMBT5551LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Date Of Intro:

    1999-01-01

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.6 A

  • Collector-Emitter Voltage-Max:

    160 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    30

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • VCEsat-Max:

    0.2 V

SMMBT5551LT1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat. Additionally, using thermal vias to connect the thermal pad to the copper area can further improve heat dissipation.
  • To ensure reliable operation at high temperatures, it is essential to follow the recommended operating conditions and derating guidelines provided in the datasheet. Additionally, ensuring good thermal design and heat dissipation, as well as using a suitable thermal interface material, can help to mitigate the effects of high temperatures.
  • The SMMBT5551LT1G has built-in ESD protection, but it is still important to follow standard ESD handling precautions when handling the device, such as using an ESD wrist strap or mat, and storing the device in an anti-static bag or container.
  • Yes, the SMMBT5551LT1G can be used in a switching regulator application, but it is essential to ensure that the device is operated within its recommended operating conditions and that the switching frequency is within the device's specified range.
  • The device should be stored in a dry, cool place, away from direct sunlight and moisture. It is also recommended to store the device in its original packaging or an anti-static bag or container to prevent damage from ESD or physical stress.

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SMMBT5551LT1G Overview

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Part Image MMBT5551_NL Fairchild Semiconductor Corporation

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For a full list of alternate parts for SMMBT5551LT1G, check out Findchips.com