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SMP5484 - InterFET

Description: JFET N-Channel -25V Low Ciss

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PCB Footprints
SMP5484 - InterFET PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT23 (TO-236AB)
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3D Models
SMP5484 - InterFET  - 3D model - SOT23 (3-Pin) - SOT23 (TO-236AB)
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SMP5484 Details

  • Manufacturer Part Number:

    SMP5484

  • Part Life Cycle Code:

    Contact Manufacturer

  • ECCN Code:

    EAR99

  • Manufacturer:

    InterFET Corporation

  • Configuration:

    SINGLE

  • FET Technology:

    JUNCTION

  • Feedback Cap-Max (Crss):

    1 pF

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    DEPLETION MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

SMP5484 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SMP5484 involves keeping the input and output traces as short as possible, using a solid ground plane, and placing bypass capacitors close to the device. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure proper biasing, make sure to follow the recommended voltage and current settings outlined in the datasheet. Typically, this involves setting the VCC pin to 5V, the VEE pin to -5V, and the ISET pin to the recommended current setting. Additionally, ensure that the input and output signals are within the recommended voltage ranges.
  • The maximum power dissipation of the SMP5484 is typically around 1.5W, depending on the specific application and operating conditions. It's essential to ensure that the device is properly heat-sinked and that the PCB design takes into account thermal management to prevent overheating.
  • Yes, the SMP5484 is designed for high-frequency applications up to 500 MHz. However, it's essential to follow proper PCB layout and design guidelines to minimize parasitic inductance and capacitance, which can affect high-frequency performance.
  • To troubleshoot common issues with the SMP5484, start by checking the PCB layout and design for any errors or omissions. Ensure that the device is properly biased and that the input and output signals are within the recommended voltage ranges. Use oscilloscopes and other diagnostic tools to identify the source of the issue, and consult the datasheet and application notes for guidance on troubleshooting and debugging.

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SMP5484 Overview

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