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SMUN5212T1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
SMUN5212T1G - onsemi - PCB symbol
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PCB Footprints
SMUN5212T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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3D Models
SMUN5212T1G - onsemi - 3D model - SOT23 (3-Pin) - SC-70 (SOT-323) CASE419-04
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SMUN5212T1G Details

  • Manufacturer Part Number:

    SMUN5212T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70 (SOT-323) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    419-04

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.1 A

  • DC Current Gain-Min (hFE):

    60

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.31 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SMUN5212T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider derating the device's power handling at high temperatures.
  • The device can withstand a maximum voltage stress of 1.5 times the rated voltage for a short duration (less than 1 second). Prolonged exposure to high voltage stress can reduce the device's lifespan.
  • Yes, but ensure that the device is properly snubbed to prevent ringing and voltage spikes. Also, consider the device's switching losses and thermal performance at high frequencies.
  • Handle the device with ESD-protective equipment, and ensure that the PCB has ESD protection circuits. Also, follow proper soldering and assembly procedures to prevent ESD damage.

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SMUN5212T1G Overview

Use the download button to access the SMUN5212T1G schematic symbol, PCB footprint, and 3D model.
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