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SMUN5314DW1T1G - onsemi

Description: Simplifies Circuit Design; Reduces Board Space; Reduces Component Count; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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Symbol
SMUN5314DW1T1G - onsemi - PCB symbol
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PCB Footprints
SMUN5314DW1T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SMUN5314DW1T1G
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3D Models
SMUN5314DW1T1G - onsemi - 3D model - SOT23 (6-Pin) - SMUN5314DW1T1G
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SMUN5314DW1T1G Details

  • Manufacturer Part Number:

    SMUN5314DW1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-88/SC70-6/SOT-363 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    419B-02

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO 4.7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.256 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SMUN5314DW1T1G Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern is recommended for optimal heat dissipation.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material to improve heat transfer between the device and the heat sink.
  • The SMUN5314DW1T1G has built-in ESD protection, but it is still recommended to follow standard ESD handling procedures during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the SMUN5314DW1T1G is suitable for high-reliability applications. However, it is recommended to follow onsemi's recommended design and manufacturing guidelines to ensure the highest level of reliability.
  • The recommended soldering conditions are 260°C peak reflow temperature, with a maximum of 3 reflow cycles. The device is also compatible with lead-free soldering processes.

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SMUN5314DW1T1G Overview

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