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SN55HVD233MDTPSEP - Texas Instruments

Description: Radiation hardened 3.3V CAN transceiver in space enhanced plastic package with standby mode

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SN55HVD233MDTPSEP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D(R-PDSO-G)
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SN55HVD233MDTPSEP Details

  • Manufacturer Part Number:

    SN55HVD233MDTPSEP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2019-02-20

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00003 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    ISO 11898-2

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.905 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    1.2 V

  • Output Low Current-Max:

    0.05 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    105 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    6 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Total Dose:

    20k Rad(Si) V

  • Transmit Delay-Max:

    1200 ns

  • Width:

    3.895 mm

SN55HVD233MDTPSEP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power planes. Use a 50-ohm impedance-controlled trace for the differential pairs.
  • Use a differential signaling scheme, keep the signal traces short and matched, and use a common-mode choke or a transformer to reduce electromagnetic interference (EMI).
  • The maximum cable length depends on the specific application and the type of cable used. As a general guideline, the device can support cable lengths up to 10 meters at 1 Gbps and up to 3 meters at 3 Gbps.
  • Use a logic analyzer or an oscilloscope to capture the signal waveforms and check for errors. Verify that the power supply and clock signals are stable and within the recommended specifications.
  • The device is rated for operation up to 125°C. However, the maximum junction temperature (TJ) should not exceed 150°C. Ensure proper thermal design and heat sinking to maintain a safe operating temperature.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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