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SN65LVDS387DGGRG4 - Texas Instruments

Description: LVDS Interface IC 16-Channel LVDS Driver

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SN65LVDS387DGGRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G64)
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SN65LVDS387DGGRG4 - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G64)
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SN65LVDS387DGGRG4 Details

  • Manufacturer Part Number:

    SN65LVDS387DGGRG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    16

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    95 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2.9 ns

  • Width:

    6.1 mm

SN65LVDS387DGGRG4 Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN65LVDS387DGGRG4 is dependent on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters at a data rate of 1.5 Gbps.
  • To ensure signal integrity with the SN65LVDS387DGGRG4, it is recommended to follow proper PCB design practices, such as using differential pairs, minimizing trace lengths, and using signal shielding. Additionally, the device's built-in features such as pre-emphasis and de-emphasis can be used to improve signal quality.
  • The power consumption of the SN65LVDS387DGGRG4 is dependent on the specific application and operating conditions. However, according to the datasheet, the typical power consumption is around 150 mW at a supply voltage of 3.3 V.
  • Yes, the SN65LVDS387DGGRG4 is rated for operation in high-temperature environments, with an operating temperature range of -40°C to 85°C. However, it is recommended to follow proper thermal design practices to ensure reliable operation.
  • The SN65LVDS387DGGRG4 can be configured for different data rates by adjusting the device's internal clock frequency and the transmission line's termination impedance. The device also has built-in features such as programmable output swing and de-emphasis to optimize signal quality at different data rates.

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SN65LVDS387DGGRG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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