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SN65LVDS86AQDGGR - Texas Instruments

Description: Flatlink Receiver

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SN65LVDS86AQDGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G48)
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SN65LVDS86AQDGGR - Texas Instruments  - 3D model - Small Outline Packages - DGG (R-PDSO-G48)
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SN65LVDS86AQDGGR Details

  • Manufacturer Part Number:

    SN65LVDS86AQDGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    7 ns

  • Receiver Number of Bits:

    3

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN65LVDS86AQDGGR Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN65LVDS86AQDGGR is approximately 10 meters (33 feet) at a data rate of 655 Mbps. However, this length can vary depending on the specific application, cable quality, and noise environment.
  • To ensure signal integrity with the SN65LVDS86AQDGGR, it is recommended to use a differential pair for the LVDS signals, keep the signal traces short and well-matched, and use a common-mode choke or ferrite bead to filter out electromagnetic interference (EMI).
  • The power consumption of the SN65LVDS86AQDGGR depends on the operating frequency and output load. At a typical operating frequency of 65 MHz, the device consumes around 150 mW of power. However, this value can vary depending on the specific application and operating conditions.
  • Yes, the SN65LVDS86AQDGGR is designed for high-speed data transmission and can support data rates up to 1.92 Gbps. It is suitable for applications that require high-speed data transmission, such as high-definition video transmission and high-speed data acquisition.
  • To troubleshoot issues with the SN65LVDS86AQDGGR, it is recommended to check the power supply voltage, signal integrity, and output load. Use an oscilloscope to verify the signal waveform and amplitude, and check for any signs of signal degradation or distortion. Also, ensure that the device is properly terminated and that the input signals are within the specified voltage range.

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SN65LVDS86AQDGGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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