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SN65LVDS9637DGKR - Texas Instruments

Description: LVDS Interface IC Dual HS Diff

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SN65LVDS9637DGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK (S-PDSO-G8)
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SN65LVDS9637DGKR - Texas Instruments  - 3D model - Small Outline Packages - DGK (S-PDSO-G8)
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SN65LVDS9637DGKR Details

  • Manufacturer Part Number:

    SN65LVDS9637DGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China, Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SN65LVDS9637DGKR Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN65LVDS9637DGKR is approximately 10 meters (33 feet) at a data rate of 1.485 Gbps. However, this length can vary depending on the specific application, cable quality, and environmental conditions.
  • To ensure signal integrity with the SN65LVDS9637DGKR, it is recommended to follow proper PCB design guidelines, use high-quality cables and connectors, and implement proper termination and impedance matching. Additionally, the use of signal conditioning circuits and equalization techniques can help to improve signal quality.
  • The power consumption of the SN65LVDS9637DGKR varies depending on the operating frequency and mode. In typical operation, the device consumes around 150 mA at 1.8V supply voltage. However, this can increase to around 250 mA at higher frequencies or in certain operating modes.
  • The SN65LVDS9637DGKR can be configured for different data rates by adjusting the clock frequency and the transmitter's pre-emphasis settings. The device also has built-in support for data rates up to 3.3 Gbps, and can be configured using the device's control pins or through an external microcontroller.
  • The SN65LVDS9637DGKR has a maximum junction temperature of 150°C. To ensure reliable operation, it is recommended to keep the device's operating temperature below 125°C. Proper thermal design and heat sinking can help to reduce the device's operating temperature and prevent overheating.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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