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SN65LVDS9637DGNG4 - Texas Instruments

Description: LVDS Receiver 8-Pin HVSSOP EP Tube

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SN65LVDS9637DGNG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGN0008D
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SN65LVDS9637DGNG4 - Texas Instruments  - 3D model - Small Outline Packages - DGN0008D
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SN65LVDS9637DGNG4 Details

  • Manufacturer Part Number:

    SN65LVDS9637DGNG4

  • Brand Name:

    Texas Instruments

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    SSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.07 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SN65LVDS9637DGNG4 Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN65LVDS9637DGNG4 is dependent on the specific application and the type of cable used. However, as a general guideline, Texas Instruments recommends a maximum cable length of 10 meters for LVDS signals.
  • To ensure signal integrity with the SN65LVDS9637DGNG4, it is recommended to follow proper PCB design and layout guidelines, such as using differential pairs, minimizing trace length and impedance mismatches, and using termination resistors as needed. Additionally, the use of a common-mode filter or a shielded cable can help to reduce electromagnetic interference (EMI).
  • Yes, the SN65LVDS9637DGNG4 can be used in a multi-point LVDS bus configuration. However, it is recommended to follow the guidelines outlined in the Texas Instruments application note 'Multi-Point LVDS Bus Design Guide' (SLVA466) to ensure proper bus operation and signal integrity.
  • The recommended power-up sequence for the SN65LVDS9637DGNG4 is to power up the VCC supply before the VCCIO supply. This ensures that the internal voltage regulators are properly initialized and that the device operates correctly.
  • To troubleshoot issues with the SN65LVDS9637DGNG4, it is recommended to follow a systematic approach, such as checking the power supply voltages, signal integrity, and device configuration. Texas Instruments also provides a range of tools and resources, such as the TI Logic Analyzer and the SN65LVDS9637DGNG4 evaluation module, to help debug and troubleshoot issues.

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SN65LVDS9637DGNG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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