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SN65LVDT101DG4 - Texas Instruments

Description: Texas Instruments SN65LVDT101DG4, LVDS Translator & Repeater CMOS 2000MBps, 3 → 3.36 V, 8-Pin, SOIC

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SN65LVDT101DG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D0008A  SOIC
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SN65LVDT101DG4 - Texas Instruments  - 3D model - Small Outline Packages - D0008A  SOIC
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SN65LVDT101DG4 Details

  • Manufacturer Part Number:

    SN65LVDT101DG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-644-A; TIA-644-A

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    DIFFERENTIAL

  • Output Low Current-Max:

    3.3e-7 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    0.9 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    61 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.9 ns

  • Width:

    3.9 mm

SN65LVDT101DG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, routing, and grounding to minimize noise and ensure reliable operation.
  • The thermal pad on the bottom of the package should be connected to a solid ground plane on the PCB to dissipate heat effectively. A thermal via or a copper pour can be used to connect the thermal pad to the ground plane.
  • The maximum cable length that can be driven by the SN65LVDT101DG4 depends on the cable characteristics, signal frequency, and desired signal integrity. As a general guideline, the device can drive cables up to 100 meters long at 100 Mbps. However, it's recommended to perform signal integrity analysis and testing to determine the maximum cable length for a specific application.
  • To ensure EMC with the SN65LVDT101DG4, follow proper PCB layout and design guidelines, use shielding and filtering as needed, and ensure that the device is operated within its specified frequency range and signal amplitude. Additionally, perform EMC testing and certification according to relevant industry standards.
  • The recommended power-up sequence for the SN65LVDT101DG4 is to power up the VCC supply before the VEE supply. This ensures that the internal circuitry is properly initialized and configured before the device becomes active.

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SN65LVDT101DG4 Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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