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SN65LVDT122D - Texas Instruments

Description: 2X2 1.5 Gbps LVDS Crosspoint Switch

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SN65LVDT122D - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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3D Models
SN65LVDT122D - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16)
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SN65LVDT122D Details

  • Manufacturer Part Number:

    SN65LVDT122D

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • High Level Input Current-Max:

    0.000002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    3.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.247 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    0.9 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    0.9 ns

  • Width:

    9.9 mm

SN65LVDT122D Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The thermal pad on the SN65LVDT122D should be connected to a thermal ground plane on the PCB to dissipate heat efficiently. A thermal via or a copper pour connected to the thermal pad can be used to achieve this. It's essential to follow the recommended thermal management guidelines to prevent overheating and ensure reliable operation.
  • The maximum cable length supported by the SN65LVDT122D depends on the specific application and the type of cable used. As a general guideline, Texas Instruments recommends keeping the cable length as short as possible (less than 10 meters) to minimize signal attenuation and ensure reliable data transmission. For longer cable lengths, signal repeaters or amplifiers may be necessary.
  • The SN65LVDT122D is specified to operate with a 3.3V supply voltage, but it can tolerate a supply voltage range of 2.7V to 3.6V. However, operating the device outside the recommended voltage range may affect its performance, power consumption, and reliability. It's essential to consult the datasheet and application notes for specific guidance on operating the device with a different voltage supply.
  • To ensure EMC with the SN65LVDT122D, follow the recommended PCB layout and design guidelines, use proper shielding and grounding techniques, and implement EMI filtering and suppression components as necessary. Additionally, consult the Texas Instruments application note SLVAE03 for specific EMC guidelines and recommendations.

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SN65LVDT122D Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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