SN74AUP1G34YFPR - Texas Instruments

SN74AUP1G34YFPR Details

• Manufacturer Part Number:

  SN74AUP1G34YFPR

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Package Description:

  DSBGA-4

• Pin Count:

  5

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.90

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Family:

  AUP/ULP/V

• JESD-30 Code:

  R-XBGA-B5

• JESD-609 Code:

  e1

• Length:

  1.4 mm

• Load Capacitance (CL):

  30 pF

• Logic IC Type:

  BUFFER

• Max I(ol):

  0.004 A

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Inputs:

  1

• Number of Terminals:

  4

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  3-STATE

• Package Body Material:

  UNSPECIFIED

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA4,2X2,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  260

• Power Supply Current-Max (ICC):

  0.0009 mA

• Prop. Delay@Nom-Sup:

  18.9 ns

• Propagation Delay (tpd):

  18.9 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  NO

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  0.8 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  0.9 mm