SN74AUP1G57YFPR - Texas Instruments

SN74AUP1G57YFPR Details

• Manufacturer Part Number:

  SN74AUP1G57YFPR

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  BGA

• Pin Count:

  6

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Manufacturer:

  Texas Instruments

• YTEOL:

  0

• Family:

  AUP/ULP/V

• JESD-30 Code:

  R-XBGA-B6

• JESD-609 Code:

  e1

• Length:

  1.17 mm

• Load Capacitance (CL):

  30 pF

• Logic IC Type:

  LOGIC CIRCUIT

• Max I(ol):

  0.004 A

• Moisture Sensitivity Level:

  1

• Number of Functions:

  1

• Number of Inputs:

  3

• Number of Terminals:

  6

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output Characteristics:

  3-STATE

• Package Body Material:

  UNSPECIFIED

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA6,2X3,16

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Packing Method:

  TR

• Peak Reflow Temperature (Cel):

  260

• Power Supply Current-Max (ICC):

  0.0009 mA

• Propagation Delay (tpd):

  26.5 ns

• Qualification Status:

  Not Qualified

• Schmitt Trigger:

  YES

• Seated Height-Max:

  0.5 mm

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  0.8 V

• Supply Voltage-Nom (Vsup):

  1.2 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.4 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  0.77 mm