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SN74CB3Q3305PWG4 - Texas Instruments

Description: Digital Bus Switch ICs 2.5V 3.3V LO VLTG HI Dual FETBus Switch

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SN74CB3Q3305PWG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW0008A
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SN74CB3Q3305PWG4 - Texas Instruments  - 3D model - Small Outline Packages - PW0008A
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SN74CB3Q3305PWG4 Details

  • Manufacturer Part Number:

    SN74CB3Q3305PWG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES WITH 3.3V SUPPLY

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.7 mA

  • Prop. Delay@Nom-Sup:

    0.09 ns

  • Propagation Delay (tpd):

    0.15 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SN74CB3Q3305PWG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance and minimize signal integrity issues.
  • The SN74CB3Q3305PWG4 has a thermal pad that must be connected to a solid ground plane to dissipate heat. A thermal via array or a thermal pad connected to a heat sink can be used to improve thermal management. The application note SLVAE03 provides more details on thermal management.
  • The maximum operating frequency of the SN74CB3Q3305PWG4 is 500 MHz, but it can be limited by the system's signal integrity, PCB layout, and termination. It's recommended to perform signal integrity analysis and simulation to ensure the device operates within its specifications.
  • Yes, the SN74CB3Q3305PWG4 is compatible with 3.3V systems, but it requires a 1.8V or 2.5V power supply for the internal logic. The device can tolerate input voltages up to 3.6V, but the output voltage will be limited to the VCCIO voltage.
  • The SN74CB3Q3305PWG4 requires proper termination to prevent signal reflections and ensure signal integrity. The datasheet provides guidelines for termination, including the use of series resistors, parallel resistors, and capacitors. It's recommended to perform simulation and analysis to determine the optimal termination scheme for the specific application.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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