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SN74CB3Q3305PWRG4 - Texas Instruments

Description: Dual FET Bus Switch 2.5-V/3.3-V Low-Voltage, High-Bandwidth

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SN74CB3Q3305PWRG4 - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW (R-PDSO-G8)
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SN74CB3Q3305PWRG4 - Texas Instruments  - 3D model - Small Outline Packages - PW (R-PDSO-G8)
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SN74CB3Q3305PWRG4 Details

  • Manufacturer Part Number:

    SN74CB3Q3305PWRG4

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    TSSOP, TSSOP8,.25

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    ALSO OPERATES WITH 3.3V SUPPLY

  • Control Type:

    ENABLE HIGH

  • Count Direction:

    UNIDIRECTIONAL

  • Family:

    CB3Q/3VH/3C/2B

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.4 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS DRIVER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    1

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.7 mA

  • Prop. Delay@Nom-Sup:

    0.09 ns

  • Propagation Delay (tpd):

    0.15 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

SN74CB3Q3305PWRG4 Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAU64, which includes guidelines for signal routing, decoupling, and thermal management to ensure optimal performance of the SN74CB3Q3305PWRG4.
  • The SN74CB3Q3305PWRG4 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a thermal pad on the PCB can be used to improve heat dissipation.
  • The maximum operating frequency for the SN74CB3Q3305PWRG4 is not explicitly stated in the datasheet, but it is typically limited by the rise and fall times of the signals. As a general guideline, the maximum operating frequency is around 100 MHz to 200 MHz, depending on the specific application and signal conditions.
  • The SN74CB3Q3305PWRG4 is rated for operation up to 125°C, but the device's performance and reliability may degrade at higher temperatures. It is recommended to consult the datasheet and application notes for specific guidance on operating the device in high-temperature environments.
  • To ensure signal integrity with the SN74CB3Q3305PWRG4, it is recommended to follow proper PCB design practices, such as using controlled impedance traces, minimizing signal routing distances, and using decoupling capacitors to reduce noise and ringing.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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