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SN74CB3T3383DWR - Texas Instruments

Description: 10-Bit FET Bus-Exchange Switch 2.5-V/3.3-V Low-Voltage Bus Switch with 5-V-Tolerant Level Shifter

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SN74CB3T3383DWR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DW (R-PDSO-G24)
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SN74CB3T3383DWR Details

  • Manufacturer Part Number:

    SN74CB3T3383DWR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-24

  • Pin Count:

    24

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Control Type:

    ENABLE LOW

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    CB3T/3VT

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    15.4 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    BUS EXCHANGER

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    2

  • Number of Functions:

    10

  • Number of Ports:

    4

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Prop. Delay@Nom-Sup:

    0.25 ns

  • Propagation Delay (tpd):

    0.25 ns

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-STD-883

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

SN74CB3T3383DWR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE03, which includes guidelines for trace routing, component placement, and decoupling capacitors to minimize signal integrity issues.
  • The SN74CB3T3383DWR requires a stable power supply with a minimum of 1.71V and a maximum of 5.5V. It is recommended to use a 0.1uF decoupling capacitor between the VCC and GND pins, and to place the capacitor as close to the device as possible.
  • The maximum operating frequency of the SN74CB3T3383DWR is 250 MHz, but this can vary depending on the specific application and operating conditions. It is recommended to consult the datasheet and application notes for more information.
  • The SN74CB3T3383DWR has a maximum junction temperature of 150°C. To ensure proper thermal management, it is recommended to use a heat sink or thermal pad, and to follow the thermal design guidelines provided in the datasheet and application notes.
  • The SN74CB3T3383DWR has an ESD protection level of 2kV human body model (HBM) and 200V machine model (MM). This means that the device can withstand electrostatic discharges up to 2kV and 200V, respectively.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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