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SN74LV165BMPWREP - Texas Instruments

Description: 2 V to 5.5 V VCC operation • Maximum tpd of 10.5 ns at 5 V • Supports mixed-mode voltage operation on all ports • Ioff supports partial-power-down mode operation • Latch-up performance exceeds 250 mA per JESD 17 • Operating ambient temperature: -55°C to +125°C • Supports defense, aerospace, and medical applications: – Controlled baseline – One assembly and test site – One fabrication site – Extended product life cycle – Product traceability

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SN74LV165BMPWREP - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP - 1.2 mm
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SN74LV165BMPWREP - Texas Instruments  - 3D model - Small Outline Packages - TSSOP - 1.2 mm
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SN74LV165BMPWREP Details

  • Manufacturer Part Number:

    SN74LV165BMPWREP

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Count Direction:

    RIGHT

  • Family:

    LV/LV-A/LVX/H

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    PARALLEL IN SERIAL OUT

  • Max Frequency@Nom-Sup:

    35000000 Hz

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    0.02 mA

  • Propagation Delay (tpd):

    26 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    4.4 mm

  • fmax-Min:

    75 MHz

SN74LV165BMPWREP Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the SN74LV165BMPWREP is 66 MHz, but it can vary depending on the operating conditions and the quality of the clock signal.
  • To ensure proper power and decoupling, use a high-quality power supply with a low noise floor, and decouple the VCC pin with a 0.1 μF ceramic capacitor and a 10 μF electrolytic capacitor in parallel, placed as close to the device as possible.
  • The recommended termination scheme for the SN74LV165BMPWREP is to use a series terminator (e.g., 33 Ω) at the far end of the transmission line, and a parallel terminator (e.g., 50 Ω) at the near end, to minimize reflections and ensure signal integrity.
  • When using the SN74LV165BMPWREP in a system with multiple clock domains, use a clock domain crossing (CDC) circuit or a clock synchronizer to ensure that the clock signal is properly synchronized and buffered to prevent metastability and data corruption.
  • The maximum capacitive load that the SN74LV165BMPWREP can drive is 30 pF, but it's recommended to keep the load capacitance as low as possible to ensure signal integrity and minimize power consumption.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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