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SN74LVC2G07DCK - Texas Instruments

Description: Dual Buffer and Driver With Open-Drain Outputs

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PCB Footprints
SN74LVC2G07DCK - Texas Instruments PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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3D Models
SN74LVC2G07DCK - Texas Instruments  - 3D model - SOT23 (6-Pin) - DCK (R-PDSO-G6)
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SN74LVC2G07DCK Details

  • Manufacturer Part Number:

    SN74LVC2G07DCK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    GREEN, PLASTIC, SC-70, 6 PIN

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2 mm

  • Logic IC Type:

    BUFFER

  • Max I(ol):

    0.032 A

  • Number of Functions:

    2

  • Number of Inputs:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP6,.08

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Power Supply Current-Max (ICC):

    0.01 mA

  • Propagation Delay (tpd):

    8.6 ns

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.65 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    1.25 mm

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SN74LVC2G07DCK Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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