SN74LVC2G66YZPR - Texas Instruments

SN74LVC2G66YZPR Details

• Manufacturer Part Number:

  SN74LVC2G66YZPR

• Brand Name:

  Texas Instruments

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  BGA

• Pin Count:

  8

• Country Of Origin:

  Mainland China

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.90

• Manufacturer:

  Texas Instruments

• YTEOL:

  15

• Additional Feature:

  Configuration : 1:1 SPST

• Analog IC - Other Type:

  SPST

• Bandwidth-Nom:

  300 MHz

• Input Voltage-Max:

  5.5 V

• JESD-30 Code:

  R-XBGA-B8

• JESD-609 Code:

  e1

• Length:

  1.9 mm

• Moisture Sensitivity Level:

  1

• Normal Position:

  NO

• Number of Channels:

  2

• Number of Functions:

  2

• Number of Terminals:

  8

• Off-state Isolation-Nom:

  42 dB

• On-state Resistance Match-Nom:

  5 Ω

• On-state Resistance-Max (Ron):

  30 Ω

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output:

  SEPARATE OUTPUT

• Package Body Material:

  UNSPECIFIED

• Package Code:

  VFBGA

• Package Equivalence Code:

  BGA8,2X4,20

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.5 mm

• Supply Current-Max (Isup):

  0.015 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  1.65 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Switch-off Time-Max:

  6.9 ns

• Switch-on Time-Max:

  5.6 ns

• Switching:

  MAKE-BEFORE-BREAK

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  0.9 mm