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SN74SSQEA32882ZALR - Texas Instruments

Description: JEDEC SSTE32882 Compliant 28-Bit to 56-Bit Registered Buffer with Address-Parity Test

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SN74SSQEA32882ZALR - Texas Instruments - PCB symbol
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PCB Footprints
SN74SSQEA32882ZALR - Texas Instruments PCB footprint - BGA - BGA - ZAL (R-PBGA-N176)
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3D Models
SN74SSQEA32882ZALR - Texas Instruments - 3D model - BGA - ZAL (R-PBGA-N176)
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SN74SSQEA32882ZALR Details

  • Manufacturer Part Number:

    SN74SSQEA32882ZALR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    BGA

  • Package Description:

    BGA-176

  • Pin Count:

    176

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Family:

    SSQE

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PBGA-B176

  • JESD-609 Code:

    e1

  • Length:

    13.5 mm

  • Logic IC Type:

    PLL BASED CLOCK DRIVER

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    176

  • Number of True Outputs:

    4

  • Operating Temperature-Max:

    85 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA176,11X20,25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    100 mA

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    1.975 V

  • Supply Voltage-Nom (Vsup):

    1.35 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    8 mm

  • fmax-Min:

    810 MHz

SN74SSQEA32882ZALR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good high-speed design practices, such as using a solid ground plane, minimizing trace lengths, and using impedance-controlled traces to ensure signal integrity.
  • The SN74SSQEA32882ZALR has a thermal pad that must be connected to a solid ground plane to dissipate heat. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary. Follow the recommended thermal design guidelines in the datasheet.
  • The input capacitance (Cin) and output capacitance (Cout) of the SN74SSQEA32882ZALR can affect signal integrity. Ensure that the total capacitance on each input and output pin does not exceed the recommended values in the datasheet to prevent signal degradation.
  • To ensure signal integrity, use controlled impedance traces, minimize trace lengths, and use signal termination resistors as recommended in the datasheet. Also, consider using signal conditioning circuits or buffers if necessary.
  • The SN74SSQEA32882ZALR requires a specific power sequencing to prevent damage. Ensure that the VCC supply is applied before the input signals, and that the VCC supply is stable before applying input signals. Follow the recommended power sequencing guidelines in the datasheet.

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SN74SSQEA32882ZALR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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