X3.129; X3.131; X3.277; EIA-485; SCSI-2; ISO 8482; IPI
JESD-30 Code:
R-PDSO-G56
JESD-609 Code:
e4
Length:
18.415 mm
Moisture Sensitivity Level:
2
Number of Functions:
9
Number of Terminals:
56
Operating Temperature-Max:
70 °C
Out Swing-Min:
1 V
Output Characteristics:
3-STATE
Output Low Current-Max:
0.008 A
Output Polarity:
COMPLEMENTARY
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Equivalence Code:
SSOP56,.4
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Receive Delay-Max:
14.5 ns
Receiver Number of Bits:
9
Seated Height-Max:
2.79 mm
Supply Current-Max:
60 mA
Supply Voltage-Max:
5.25 V
Supply Voltage-Min:
4.75 V
Supply Voltage-Nom:
5 V
Supply Voltage1-Max:
5.25 V
Supply Voltage1-Min:
4.75 V
Supply Voltage1-Nom:
5 V
Surface Mount:
YES
Technology:
BICMOS
Temperature Grade:
COMMERCIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
0.635 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transmit Delay-Max:
11.5 ns
Width:
7.5 mm
SN75976A2DL Frequently Asked Questions (FAQs)
Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good layout practices, such as keeping the input and output traces short, using a solid ground plane, and minimizing noise coupling. Additionally, consider using a 4-layer PCB with a dedicated power plane and a separate ground plane.
To ensure reliable operation, follow the recommended operating conditions, including voltage and current ratings. Implement thermal management techniques, such as heat sinks or thermal pads, to maintain a safe junction temperature. Also, consider using a temperature sensor to monitor the device temperature and adjust the system accordingly.
To minimize EMI and RFI, use a shielded enclosure, and ensure that the PCB layout is designed to reduce radiation. Implement filtering, such as ferrite beads or common-mode chokes, on the input and output lines. Additionally, consider using a spread-spectrum clock generator to reduce EMI emissions.
To troubleshoot issues, start by reviewing the system design and ensuring that the device is operated within its recommended specifications. Use oscilloscopes and logic analyzers to monitor the device's input and output signals. Check for power supply noise, voltage drops, and thermal issues. Consult the datasheet and application notes for guidance on troubleshooting specific issues.
When using a different voltage regulator or power supply, ensure that it meets the recommended voltage and current ratings. Verify that the power supply noise and ripple are within the acceptable limits specified in the datasheet. Additionally, consider the power supply's transient response and its ability to handle inrush currents.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SN75976A2DL Overview
Use the download button to access the SN75976A2DL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SN759,
or try a keyword search, such as Line Driver or Receivers
About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
