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SN75LBC173DR - Texas Instruments

Description: RS-422/RS-485 Interface IC Quadruple Low-Power Diff Line Receiver

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SN75LBC173DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16).
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SN75LBC173DR - Texas Instruments  - 3D model - Small Outline Packages - D (R-PDSO-G16).
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SN75LBC173DR Details

  • Manufacturer Part Number:

    SN75LBC173DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOIC-16

  • Pin Count:

    16

  • Country Of Origin:

    Mexico

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Differential Output:

    NO

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; EIA-485; V.10; V.11

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    3 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    30 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3.9 mm

SN75LBC173DR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLVAE04, which includes guidelines for component placement, trace routing, and grounding to minimize EMI and ensure signal integrity.
  • The termination resistors should be chosen based on the transmission line impedance and the signal frequency. A general rule of thumb is to use a termination resistor equal to the transmission line impedance (e.g., 50 ohms for a 50-ohm transmission line). For more information, refer to the application note SLLA319.
  • The maximum cable length supported by the SN75LBC173DR depends on the signal frequency, cable type, and transmission line impedance. As a general guideline, the maximum cable length for a 100-MHz signal is around 10 meters. For more information, refer to the application note SLLA319.
  • The SN75LBC173DR requires a stable power supply and proper decoupling to ensure reliable operation. Use a low-ESR capacitor (e.g., 0.1 uF) close to the device's power pins, and consider adding a 10-uF capacitor in parallel to filter out noise. Refer to the datasheet for more information on power supply and decoupling requirements.
  • The SN75LBC173DR has a maximum junction temperature of 150°C. Ensure proper heat dissipation by providing a thermal pad on the PCB, using a heat sink if necessary, and keeping the device away from other heat sources. Refer to the datasheet for more information on thermal characteristics and heat dissipation guidelines.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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