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SN75LVDS31PW - Texas Instruments

Description: LVDS Interface IC Quad HS Diff

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SN75LVDS31PW - Texas Instruments - PCB symbol
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SN75LVDS31PW - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - PW
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SN75LVDS31PW - Texas Instruments - 3D model - Small Outline Packages - PW
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SN75LVDS31PW Details

  • Manufacturer Part Number:

    SN75LVDS31PW

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.00002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    6 ns

  • Width:

    4.4 mm

SN75LVDS31PW Frequently Asked Questions (FAQs)

  • The maximum cable length depends on the specific application and the signal frequency. As a general rule, the maximum cable length for LVDS signals is around 10-15 meters. However, it's recommended to consult the TI application note 'LVDS Owner's Manual' (SLMA002) for more detailed information on cable length and signal integrity.
  • While the SN75LVDS31PW is designed for LVDS applications, it can be used for other differential signaling standards like RS-422 or RS-485 with some limitations. However, the device's common-mode range and differential output voltage may not be optimized for these standards, and additional circuitry may be required to ensure compatibility.
  • The SN75LVDS31PW requires a 100-ohm differential termination resistor at the receiving end of the cable to maintain signal integrity. The termination resistor should be placed as close to the receiver as possible to minimize reflections and ensure proper signal termination.
  • The power consumption of the SN75LVDS31PW depends on the operating frequency and the load conditions. According to the datasheet, the typical power consumption is around 15-20 mA per channel at a 3.3V supply voltage and a 100Mbps data rate. However, this value can vary depending on the specific application and operating conditions.
  • The SN75LVDS31PW is rated for operation up to 85°C (Tj). However, the device's performance and reliability may degrade at higher temperatures. If your application requires operation above 85°C, you should consult the TI datasheet and application notes for guidance on thermal management and derating.

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SN75LVDS31PW Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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