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SN75LVDS32DR - Texas Instruments

Description: LVDS Interface IC Quad HS Differential Receivers

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SN75LVDS32DR - Texas Instruments - PCB symbol
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SN75LVDS32DR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - D (R-PDSO-G16)
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SN75LVDS32DR - Texas Instruments - 3D model - Small Outline Packages - D (R-PDSO-G16)
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SN75LVDS32DR Details

  • Manufacturer Part Number:

    SN75LVDS32DR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Country Of Origin:

    Mexico

  • ECCN Code:

    5A991.B.1

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    6 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    18 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SN75LVDS32DR Frequently Asked Questions (FAQs)

  • The maximum cable length depends on the specific application and the signal frequency. As a general rule, the maximum cable length for LVDS signals is around 10-15 meters. However, it's recommended to consult the TI application note 'LVDS Owner's Manual' (SLMA002) for more detailed information on cable length and signal integrity.
  • No, the SN75LVDS32DR is specifically designed for LVDS applications and is not compatible with TTL or CMOS signals. The device is optimized for low-voltage differential signaling and may not function correctly or may be damaged if used with non-LVDS signals.
  • The SN75LVDS32DR requires a 100-ohm differential termination resistor at the receiver end to ensure proper signal integrity. The termination resistor should be placed as close to the receiver as possible to minimize signal reflections. Additionally, the transmitter output should be AC-coupled to the receiver input using a capacitor to block any DC offset.
  • The power consumption of the SN75LVDS32DR depends on the operating frequency and the load capacitance. According to the datasheet, the typical power consumption is around 15-20 mA per channel at a frequency of 100 MHz. However, this value can increase to around 30-40 mA per channel at higher frequencies (e.g., 400 MHz).
  • No, the SN75LVDS32DR is designed for point-to-point connections and is not suitable for multi-point bus configurations. The device is optimized for high-speed, low-latency transmission over short distances and may not function correctly in a multi-point bus configuration.

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SN75LVDS32DR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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