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SN75LVDS386DGG - Texas Instruments

Description: 16-Channel LVDS Receiver

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SN75LVDS386DGG - Texas Instruments - PCB symbol
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PCB Footprints
SN75LVDS386DGG - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDS386DGG - Texas Instruments - 3D model - Small Outline Packages - DGG (R-PDSO-G**)
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SN75LVDS386DGG Details

  • Manufacturer Part Number:

    SN75LVDS386DGG

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • High Level Input Current-Max:

    0.00001 A

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    2 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    4 ns

  • Receiver Number of Bits:

    16

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    70 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN75LVDS386DGG Frequently Asked Questions (FAQs)

  • The maximum cable length depends on the specific application and the signal frequency. As a general rule, the maximum cable length for LVDS signals is around 10-15 meters at a frequency of 100 MHz. However, it's recommended to consult the TI application note 'LVDS Owner's Manual' for more detailed information on cable length and signal integrity.
  • The LVDS outputs of the SN75LVDS386DGG should be terminated with a 100-ohm differential load to ensure proper signal integrity and to prevent signal reflections. The termination resistors should be placed as close to the receiver as possible.
  • Yes, the SN75LVDS386DGG can operate with a 3.3V power supply. However, the device's output voltage swing will be reduced, which may affect the signal integrity. It's recommended to consult the datasheet and the TI application note 'LVDS Owner's Manual' for more information on power supply and output voltage swing.
  • The SN75LVDS386DGG has a thermal pad on the bottom of the package that should be connected to a thermal ground plane on the PCB to ensure proper heat dissipation. The device's junction temperature should be kept below 150°C to ensure reliable operation.
  • The SN75LVDS386DGG is rated for operation up to 85°C ambient temperature. However, the device's performance and reliability may be affected at higher temperatures. It's recommended to consult the datasheet and the TI application note 'LVDS Owner's Manual' for more information on temperature range and derating.

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SN75LVDS386DGG Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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