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SN75LVDS387DGG - Texas Instruments

Description: 16-Channel LVDS Transmitter

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SN75LVDS387DGG - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - tssop-64
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SN75LVDS387DGG - Texas Instruments  - 3D model - Small Outline Packages - tssop-64
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SN75LVDS387DGG Details

  • Manufacturer Part Number:

    SN75LVDS387DGG

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-64

  • Pin Count:

    64

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    16

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G64

  • JESD-609 Code:

    e4

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    16

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP64,.32,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    95 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2.9 ns

  • Width:

    6.1 mm

SN75LVDS387DGG Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN75LVDS387DGG is dependent on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters at a data rate of 1.5 Gbps.
  • To ensure signal integrity with the SN75LVDS387DGG, it is recommended to follow proper PCB design and layout guidelines, use high-quality cables and connectors, and implement proper termination and impedance matching techniques.
  • Yes, the SN75LVDS387DGG can be used in a multi-point configuration, but it requires careful consideration of the system design and layout to ensure proper signal integrity and noise reduction.
  • The power consumption of the SN75LVDS387DGG is typically around 150 mW, but this can vary depending on the specific application and operating conditions.
  • Yes, the SN75LVDS387DGG is compatible with other LVDS devices that comply with the TIA/EIA-644 LVDS standard.

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SN75LVDS387DGG Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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