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SN75LVDS84DGGR - Texas Instruments

Description: Data Channel Compression at up to 163 Million Bytes per Second Throughput Suited for SVGA, XGA, or SXGA Data Transmission From Controller to Display With Very

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SN75LVDS84DGGR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGG0048A
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SN75LVDS84DGGR Details

  • Manufacturer Part Number:

    SN75LVDS84DGGR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-48

  • Pin Count:

    48

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G48

  • JESD-609 Code:

    e4

  • Length:

    12.5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    0.247 V

  • Output Characteristics:

    TOTEM-POLE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP48,.3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6.1 mm

SN75LVDS84DGGR Frequently Asked Questions (FAQs)

  • The maximum cable length supported by the SN75LVDS84DGGR is dependent on the specific application and the type of cable used. However, as a general guideline, the device can support cable lengths of up to 10 meters (33 feet) at a data rate of 1.5 Gbps.
  • To ensure signal integrity with the SN75LVDS84DGGR, it is recommended to follow proper PCB design and layout guidelines, such as using differential pairs, minimizing trace lengths, and using shielding and termination resistors as needed. Additionally, the use of high-quality cables and connectors can also help to minimize signal degradation.
  • The power consumption of the SN75LVDS84DGGR is dependent on the specific application and operating conditions. However, according to the datasheet, the typical power consumption is around 150 mW at a supply voltage of 3.3 V and a data rate of 1.5 Gbps.
  • Yes, the SN75LVDS84DGGR is rated for operation over a temperature range of -40°C to 85°C, making it suitable for use in high-temperature applications. However, it is recommended to follow proper thermal management practices to ensure reliable operation.
  • To troubleshoot issues with the SN75LVDS84DGGR, it is recommended to follow a systematic approach, starting with verifying the power supply and clock signals, then checking the transmitter and receiver circuits, and finally verifying the data transmission and reception. Additionally, using oscilloscopes and logic analyzers can help to identify signal integrity issues.

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SN75LVDS84DGGR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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