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SNJ55LBC172J - Texas Instruments

Description: QUADRUPLE LOW-POWER DIFFERENTIAL LINE DRIVER

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SNJ55LBC172J - Texas Instruments PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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SNJ55LBC172J - Texas Instruments  - 3D model - Ceramic Dual-In-Line Packages - J(R-GDIP-T16)
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SNJ55LBC172J Details

  • Manufacturer Part Number:

    SNJ55LBC172J

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.0001 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-485

  • JESD-30 Code:

    R-GDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.56 mm

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Out Swing-Min:

    1.1 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0001 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    CERAMIC, GLASS-SEALED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    MIL-PRF-38535

  • Seated Height-Max:

    5.08 mm

  • Supply Current-Max:

    7 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.25 V

  • Supply Voltage1-Min:

    4.75 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    BICMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    40 ns

  • Width:

    7.62 mm

SNJ55LBC172J Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in their application note SLVAE04, which includes guidelines for component placement, trace routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The SNJ55LBC172J has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a heat sink, thermal interface material, and ensuring good airflow around the device. Texas Instruments provides thermal management guidelines in their application note SLVAE04.
  • Although the datasheet specifies the recommended operating conditions, it's essential to note that the input pins of the SNJ55LBC172J are not designed to withstand voltages above the supply voltage (VCC). Applying voltages higher than VCC can cause damage to the device. It's recommended to use voltage limiting resistors or clamping diodes to protect the input pins.
  • The SNJ55LBC172J is a commercial-grade device, and its reliability and performance may not meet the requirements of high-reliability or automotive applications. Texas Instruments offers automotive-grade and high-reliability versions of the device, such as the SNJ55LBC172J-Q1, which are specifically designed and tested for these applications.
  • Texas Instruments provides a troubleshooting guide in their application note SLVAE04, which includes steps to identify and resolve common issues with the SNJ55LBC172J. Additionally, engineers can use tools such as oscilloscopes, logic analyzers, and debugging software to diagnose and debug issues with the device.

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SNJ55LBC172J Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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