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SP211ECA-L/TR - MaxLinear, Inc.

Description: RS-232 Interface IC 5V 4-DRVR/5-RCVR RS-232 0-70C

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SP211ECA-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - SP211ECA-L/TR
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SP211ECA-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - SP211ECA-L/TR
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SP211ECA-L/TR Details

  • Manufacturer Part Number:

    SP211ECA-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Additional Feature:

    LOW POWER SHUTDOWN AND TRI-STATE ENABLE

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1500 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.29 mm

SP211ECA-L/TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use the power-down mode (PD) to reduce power consumption when not in use. Also, adjust the bias current (IB) and the output current (IO) to minimize power consumption while maintaining required performance.
  • Use controlled impedance traces, minimize trace length and stubs, and add termination resistors as needed. Also, ensure signal lines are routed away from noise sources and power planes.
  • Use a metal shield or a Faraday cage to enclose the device, and ensure proper grounding and decoupling. Also, use EMI filters and shielding on cables and connectors.
  • Use a high-speed oscilloscope and a signal generator to measure frequency response, gain, and noise figure. Also, use a network analyzer for S-parameter measurements.

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SP211ECA-L/TR Overview

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