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SP213ECA-L/TR - MaxLinear, Inc.

Description: RS-232 Interface IC 5V 4-DRVR/5-RCVR RS-232 0-70C

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SP213ECA-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - SSOP28 PIN
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SP213ECA-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - SSOP28 PIN
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SP213ECA-L/TR Details

  • Manufacturer Part Number:

    SP213ECA-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Additional Feature:

    LOW POWER SHUTDOWN AND TRI-STATE ENABLE AND WAKE-UP FUNCTION

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    1500 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    1.99 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.29 mm

SP213ECA-L/TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the analog and digital grounds separate, using a solid ground plane, and placing decoupling capacitors close to the device. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad connection.
  • To optimize power consumption, use the device's power-down modes, adjust the clock frequency, and minimize the use of unnecessary features. Additionally, consider using a lower voltage supply and optimizing the external component selection.
  • For EMI protection, use a shielded enclosure, keep the device away from noise sources, and use EMI filters on the input/output lines. For ESD protection, use ESD-protection diodes, follow proper handling and storage procedures, and ensure the device is properly grounded.
  • To troubleshoot, start by checking the power supply, clock, and reset signals. Verify the device is properly configured and initialized. Use debugging tools like logic analyzers or oscilloscopes to identify signal integrity issues. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • For high-reliability or high-temperature environments, ensure the device is properly derated, use a heat sink if necessary, and follow the recommended operating conditions. Consider using a device with a higher temperature rating or a more robust package option.

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SP213ECA-L/TR Overview

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