LOW POWER SHUTDOWN AND TRI-STATE ENABLE AND WAKE-UP FUNCTION
Differential Output:
NO
Driver Number of Bits:
4
Input Characteristics:
SCHMITT TRIGGER
Interface IC Type:
LINE TRANSCEIVER
Interface Standard:
EIA-232; V.28
JESD-30 Code:
R-PDSO-G28
JESD-609 Code:
e3
Length:
10.2 mm
Moisture Sensitivity Level:
2
Number of Functions:
4
Number of Terminals:
28
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SSOP
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Receive Delay-Max:
1500 ns
Receiver Number of Bits:
5
Seated Height-Max:
1.99 mm
Supply Voltage-Max:
5.5 V
Supply Voltage-Min:
4.5 V
Supply Voltage-Nom:
5 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
Width:
5.29 mm
SP213EEA-L/TR Frequently Asked Questions (FAQs)
The recommended PCB layout involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device near the signal sources. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad connection.
To optimize power consumption, use the device's power-down modes, reduce the clock frequency, and minimize the number of active channels. Additionally, consider using a lower supply voltage and optimizing the external component selection.
For EMI protection, use a shielded enclosure, keep the device away from high-frequency sources, and use EMI filters on the input/output lines. For ESD protection, use ESD-protection diodes, follow proper handling and storage procedures, and ensure the device is properly grounded.
To troubleshoot, start by verifying the power supply and clock signals. Check for proper device configuration, signal integrity, and data transmission protocols. Use oscilloscopes and logic analyzers to debug the issue, and consult the datasheet and application notes for guidance.
For high-temperature environments, ensure the device is properly heat-sinked, and the PCB is designed for thermal expansion. Follow the recommended operating temperature range, and consider using thermal interface materials to improve heat transfer.
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SP213EEA-L/TR Overview
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