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SP213EHCA-L/TR - MaxLinear, Inc.

Description: RS-232 Interface IC 460KBPS 4DRVR/5RCVR RS-232 0-70C

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PCB Footprints
SP213EHCA-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - SSOP28 PIN
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3D Models
SP213EHCA-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - SSOP28 PIN
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SP213EHCA-L/TR Details

  • Manufacturer Part Number:

    SP213EHCA-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Packing Method:

    TR

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    500 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    5.3 mm

SP213EHCA-L/TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the analog and digital grounds separate, using a solid ground plane, and placing decoupling capacitors close to the device. For thermal management, ensure good airflow, use a heat sink if necessary, and follow the recommended thermal pad connection.
  • To optimize power consumption, use the device's power-down modes, adjust the clock frequency, and use the built-in power-saving features. Additionally, consider using a low-dropout regulator (LDO) to reduce power consumption.
  • Use a multi-layer PCB with a solid ground plane, add EMI filters, and ensure proper shielding. For ESD protection, use TVS diodes, add a series resistor to the input, and follow the recommended PCB layout guidelines.
  • Use a logic analyzer or oscilloscope to debug the signal, check the clock frequency and signal integrity, and verify the device's configuration and register settings. Also, ensure proper termination and signal routing.
  • Use a signal generator to test the device's frequency response, and a logic analyzer or oscilloscope to verify the device's output. Also, perform bit error rate testing (BERT) to ensure reliable data transmission.

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