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SP3082EEN-L/TR - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC RS485/RS422 Driver/ Receiver Transceiver

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SP3082EEN-L/TR - MaxLinear, Inc. - PCB symbol
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SP3082EEN-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - 8-PIN NSOIC
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SP3082EEN-L/TR - MaxLinear, Inc. - 3D model - Small Outline Packages - 8-PIN NSOIC
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SP3082EEN-L/TR Details

  • Manufacturer Part Number:

    SP3082EEN-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    5 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; TIA-485; TIA-422; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    200 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Transmit Delay-Max:

    2600 ns

  • Width:

    3.9 mm

SP3082EEN-L/TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use a common mode filter and a ferrite bead to reduce EMI.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, and use a voltage regulator if necessary.
  • Use a single, low-jitter clock source (e.g., a crystal oscillator) and distribute it to the device using a clock buffer or repeater. Ensure the clock signal is clean and has minimal skew.
  • Use the device's power-down modes (e.g., shutdown, standby) when not in use. Optimize the clock frequency and voltage supply to minimize power consumption. Consider using a dynamic voltage and frequency scaling (DVFS) scheme.
  • Ensure good airflow around the device, and use a heat sink or thermal pad if necessary. Keep the device away from heat sources and ensure the PCB is designed for good thermal dissipation.

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SP3082EEN-L/TR Overview

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For a full list of alternate parts for SP3082EEN-L/TR, check out Findchips.com