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SP3088EEN-L - EXAR

Description: EXAR SP3088EEN-L, Line Transceiver, EIA/TIA-485/ RS-422/ RS-485, 5 V, 8-Pin SOIC

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PCB Footprints
SP3088EEN-L - EXAR PCB footprint - Other - Other - SOIC127P600X175-8N
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3D Models
SP3088EEN-L - EXAR  - 3D model - Other - SOIC127P600X175-8N
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SP3088EEN-L Details

  • Manufacturer Part Number:

    SP3088EEN-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    ROHS COMPLIANT, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Exar Corporation

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; TIA-485; TIA-422; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    75 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transmit Delay-Max:

    20 ns

  • Width:

    3.9 mm

SP3088EEN-L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF) for power decoupling, and place it as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range (3.3V ± 10%).
  • The SP3088EEN-L can achieve data transfer rates up to 100 Mbps, but the actual rate depends on the system design, PCB layout, and cable quality.
  • Use a logic analyzer or oscilloscope to monitor the signal quality and timing. Check the PCB layout, power supply, and signal integrity. Verify the device is properly configured and the firmware is up-to-date.
  • Yes, the SP3088EEN-L is designed to support hot-swapping. However, ensure the system is designed to handle the inrush current and voltage transients during hot-swapping.

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SP3088EEN-L Overview

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