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SP3223EUEY-L/TR - MaxLinear, Inc.

Description: RS-232 Interface IC HIGH SPD INTELLIGENT +3V-+5.5V RS-232

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SP3223EUEY-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - 20 PIN TSSOP
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SP3223EUEY-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - 20 PIN TSSOP
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SP3223EUEY-L/TR Details

  • Manufacturer Part Number:

    SP3223EUEY-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MO-153, TSSOP-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

SP3223EUEY-L/TR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, and place it as close to the device as possible. Ensure the power supply is clean and regulated, and use a ferrite bead or inductor to filter out high-frequency noise.
  • A high-quality, low-jitter clock source (e.g., a crystal oscillator or a high-stability clock generator) is recommended. Ensure the clock frequency is within the specified range (e.g., 1.536 MHz to 40.96 MHz).
  • Use the device's power-down modes (e.g., shutdown, standby) when not transmitting or receiving data. Optimize the clock frequency and voltage regulator settings for the specific application. Consider using a low-power mode for the crystal oscillator.
  • Use a shielded enclosure, and ensure good grounding and bonding between the PCB and the enclosure. Use EMI filters or common-mode chokes on the I/O lines, and consider using a shielded cable for the serial interface.

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SP3223EUEY-L/TR Overview

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