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SP335EER1-L/TR - MaxLinear, Inc.

Description: Interface - Specialized RS-232/485/422 Tnscvr w/ Intrl Term

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SP335EER1-L/TR - MaxLinear, Inc. PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SP335EER1-L/TR
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SP335EER1-L/TR - MaxLinear, Inc.  - 3D model - Quad Flat No-Lead - SP335EER1-L/TR
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SP335EER1-L/TR Details

  • Manufacturer Part Number:

    SP335EER1-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6

  • Additional Feature:

    IT ALSO SUPPORTS 1 DRIVER, 1 RECEIVER WITH INTERFACE STANDARD RS-485/422

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1000 ns

  • Width:

    5 mm

SP335EER1-L/TR Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing decoupling capacitors close to the device. Thermal management involves using a heat sink or thermal pad to keep the junction temperature below 125°C.
  • To ensure EMC and reduce EMI, use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and use filtering and shielding on the PCB. Additionally, follow the recommended layout and grounding practices.
  • The input and output capacitors should be low-ESR, high-frequency capacitors with a voltage rating above the maximum input voltage. Select capacitors with a capacitance value between 1-10uF, and consider factors like temperature range, ripple current, and physical size.
  • Use a logic analyzer or oscilloscope to debug issues. Common pitfalls to avoid include incorrect pin connections, inadequate power supply decoupling, and insufficient thermal management. Also, ensure that the device is operated within the recommended operating conditions.
  • The SP335EER1-L/TR is built with high-reliability materials and manufacturing processes, and it complies with industry standards like RoHS, REACH, and ISO 9001. The device is also qualified to AEC-Q100 and meets the requirements of IEC 60747-5-5.

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SP335EER1-L/TR Overview

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