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SP335EER1-L - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC RS-232/RS-485/RS-422 Transceiver

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PCB Footprints
SP335EER1-L - MaxLinear, Inc. PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SP335EER1-L
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3D Models
SP335EER1-L - MaxLinear, Inc.  - 3D model - Quad Flat No-Lead - SP335EER1-L
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SP335EER1-L Details

  • Manufacturer Part Number:

    SP335EER1-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-32

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6

  • Additional Feature:

    IT ALSO SUPPORTS 1 DRIVER, 1 RECEIVER WITH INTERFACE STANDARD RS-485/422

  • Differential Output:

    YES

  • Driver Number of Bits:

    2

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    S-XQCC-N32

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1000 ns

  • Width:

    5 mm

SP335EER1-L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use the device's low-power modes (e.g., sleep mode) and adjust the clock frequency to minimize power consumption. Additionally, consider using a power gating technique to turn off unused blocks.
  • The internal voltage regulators should be set to 1.2V for the core and 1.8V for the I/O. However, these values may vary depending on the specific application and power requirements.
  • Use a shielded enclosure, ensure proper grounding, and add EMI filters to the power supply lines. Additionally, follow good PCB layout practices, such as separating analog and digital circuits.
  • The device has a maximum junction temperature of 150°C. Derating factors should be applied based on the ambient temperature, with a maximum derating of 0.5°C/W above 70°C.

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