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SP336EEY-L - MaxLinear, Inc.

Description: Interface - Specialized 4 Tx/Rx Programmable RS232/485/422 Serial

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PCB Footprints
SP336EEY-L - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - 28 PIN TSSOP
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3D Models
SP336EEY-L - MaxLinear, Inc.  - 3D model - Small Outline Packages - 28 PIN TSSOP
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SP336EEY-L Details

  • Manufacturer Part Number:

    SP336EEY-L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-28

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    7.2

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.11; V.28; EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0025 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    150 ns

  • Receiver Number of Bits:

    4

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1500 ns

  • Width:

    4.4 mm

SP336EEY-L Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use the lowest possible supply voltage, disable unused features, and adjust the bias current to minimize power consumption. Also, consider using the device's power-down mode when not in use.
  • The SP336EEY-L has built-in ESD protection diodes, but additional external protection may be necessary depending on the application. Follow proper PCB design and handling practices to prevent latch-up.
  • The SP336EEY-L is rated for operation up to 85°C. For higher temperatures, consider using a heat sink or a thermally-enhanced package. Consult the datasheet for thermal derating information.
  • Check the PCB layout for signal integrity issues, ensure proper decoupling, and verify the device is operated within its recommended specifications. Consult the datasheet and application notes for troubleshooting guidelines.

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SP336EEY-L Overview

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