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SP490EEN-L/TR - MaxLinear, Inc.

Description: RS-422/RS-485 Interface IC Full Duplex RS-485 s

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SP490EEN-L/TR - MaxLinear, Inc. PCB footprint - Small Outline Packages - Small Outline Packages - NSOIC8
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SP490EEN-L/TR - MaxLinear, Inc.  - 3D model - Small Outline Packages - NSOIC8
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SP490EEN-L/TR Details

  • Manufacturer Part Number:

    SP490EEN-L/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, MS-012AA, SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    MaxLinear Inc

  • YTEOL:

    6.72

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    100 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transmit Delay-Max:

    60 ns

  • Width:

    3.9 mm

SP490EEN-L/TR Frequently Asked Questions (FAQs)

  • MaxLinear recommends a 4-layer PCB with a solid ground plane, and thermal vias under the package to dissipate heat. A thermal pad on the bottom of the package should be connected to a heat sink or a thermal plane on the PCB.
  • Use a Smith chart to optimize the input impedance matching. MaxLinear provides a recommended impedance matching circuit in the application note. Additionally, consider using a 50-ohm transmission line and a pi-network or a T-network for impedance matching.
  • Power up the device in the following sequence: VCC, VDD, and then enable the chip. Power down in the reverse sequence. Ensure that the power supplies are stable and within the recommended voltage range before enabling the device.
  • Use a logic analyzer or an oscilloscope to monitor the device's signals. Check the device's status registers and error flags. Consult the datasheet and application notes for troubleshooting guidelines and common issues.
  • Handle the device by the body, not the leads. Use an anti-static wrist strap or mat. Store the device in an anti-static bag or tube. Follow the JEDEC standard for ESD protection and handling.

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SP490EEN-L/TR Overview

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