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SPB80P06PGATMA1 - Infineon

Description: Infineon SPB80P06PGATMA1 P-channel MOSFET, 80 A, 60 V SIPMOS, 3-Pin D2PAK

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PCB Footprints
SPB80P06PGATMA1 - Infineon PCB footprint - Other - Other - PG-TO263-3_FFW
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3D Models
SPB80P06PGATMA1 - Infineon  - 3D model - Other - PG-TO263-3_FFW
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SPB80P06PGATMA1 Details

  • Manufacturer Part Number:

    SPB80P06PGATMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK

  • Package Description:

    GREEN, PLASTIC, TO-263, 3 PIN

  • Pin Count:

    4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    823 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    80 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    320 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Element Material:

    SILICON

SPB80P06PGATMA1 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the SPB80P06PGATMA1 is -40°C to 150°C.
  • A recommended PCB layout for optimal thermal performance would be to use a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • To ensure reliable operation in high-humidity environments, it is recommended to apply a conformal coating to the PCB and ensure that the device is properly sealed to prevent moisture ingress.
  • The recommended soldering conditions for the SPB80P06PGATMA1 are a peak temperature of 260°C, with a soldering time of 10-30 seconds.
  • To prevent ESD damage, it is recommended to handle the SPB80P06PGATMA1 in an ESD-protected environment, using ESD-protective packaging and handling tools, and ensuring that all personnel handling the device are grounded.

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SPB80P06PGATMA1 Overview

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Image Part Number Model
Part Image SPB80P06PG Infineon Technologies AG

Power Field-Effect Transistor, 80A I(D), 60V, 0.023ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB

Part Image SPB80P06P Infineon Technologies AG

Power Field-Effect Transistor, 80A I(D), 60V, 0.023ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB