Description:Pb-Free Package is Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable
HALOGEN FREE AND ROHS COMPLIANT, 318E-04, TO-261, 4 PIN
Pin Count:
4
Manufacturer Package Code:
0.0318
Country Of Origin:
Malaysia
ECCN Code:
EAR99
Factory Lead Time:
10 Weeks
Manufacturer:
onsemi
YTEOL:
7
Case Connection:
COLLECTOR
Collector Current-Max (IC):
0.5 A
Collector-Emitter Voltage-Max:
300 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
40
JEDEC-95 Code:
TO-261AA
JESD-30 Code:
R-PDSO-G4
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
4
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
1.5 W
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Element Material:
SILICON
Transition Frequency-Nom (fT):
50 MHz
SPZTA42T1G Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal via array under the device to improve heat dissipation.
Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Ensure the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C.
Monitor the device's junction temperature (TJ), drain-source voltage (VDS), drain current (ID), and gate-source voltage (VGS) to detect potential faults and ensure reliable operation.
Choose a gate driver with a sufficient current capability, low propagation delay, and a voltage rating that matches the device's VGS. Ensure the gate driver can provide a fast rise and fall time to minimize switching losses.
Implement ESD protection measures such as using ESD-sensitive handling procedures, ESD-protected workstations, and incorporating ESD protection devices (e.g., TVS diodes) in the circuit design.
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SPZTA42T1G Overview
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