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SQ1912EH-T1_GE3 - Vishay

Description: MOSFET 20V Vds 0.8A Id AEC-Q101 Qualified

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PCB Footprints
SQ1912EH-T1_GE3 - Vishay PCB footprint - Other - Other - SOT-363_(SC-70)
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3D Models
SQ1912EH-T1_GE3 - Vishay  - 3D model - Other - SOT-363_(SC-70)
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SQ1912EH-T1_GE3 Details

  • Manufacturer Part Number:

    SQ1912EH-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-70, SOT-363, 6 PIN

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Date Of Intro:

    2016-07-19

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.8 A

  • Drain-source On Resistance-Max:

    0.28 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    12 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SQ1912EH-T1_GE3 Frequently Asked Questions (FAQs)

  • The recommended storage condition for SQ1912EH-T1_GE3 is in a dry, cool place, away from direct sunlight, with a temperature range of -40°C to 125°C and humidity below 60%.
  • Yes, SQ1912EH-T1_GE3 is suitable for high-frequency applications up to 1 GHz due to its low equivalent series resistance (ESR) and high self-resonant frequency.
  • During soldering, use a soldering iron with a temperature below 260°C and avoid applying excessive force or bending, which can cause damage to the component.
  • Yes, SQ1912EH-T1_GE3 is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.
  • The recommended PCB layout for SQ1912EH-T1_GE3 involves using a land pattern with a minimum pad size of 1.5 mm x 1.5 mm, and ensuring a minimum clearance of 0.5 mm around the component.

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SQ1912EH-T1_GE3 Overview

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