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SQ2364EES-T1_GE3 - Vishay

Description: Automotive N-Channel 60 V (D-S)175C MOS

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Symbol
SQ2364EES-T1_GE3 - Vishay - PCB symbol
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PCB Footprints
SQ2364EES-T1_GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)-1
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3D Models
SQ2364EES-T1_GE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)-1
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SQ2364EES-T1_GE3 Details

  • Manufacturer Part Number:

    SQ2364EES-T1_GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    1.25 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.245 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    19 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    8 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    48 ns

  • Turn-on Time-Max (ton):

    21.2 ns

SQ2364EES-T1_GE3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SQ2364EES-T1_GE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for Vishay's SQ Series' (document number: 37042).
  • For thermal management, ensure a good thermal interface between the device and the PCB. Use a thermal pad or thermal interface material to reduce thermal resistance. A heat sink or thermal via can also be used to dissipate heat efficiently.
  • The maximum operating temperature range for SQ2364EES-T1_GE3 is -55°C to +150°C. However, the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • Yes, SQ2364EES-T1_GE3 is suitable for high-reliability applications. It is built with a robust design and undergoes rigorous testing to ensure its performance and reliability in demanding environments.
  • Follow the recommended soldering profile and temperature guidelines to ensure proper soldering. Avoid overheating or underheating the device, as this can cause damage or affect its performance.

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SQ2364EES-T1_GE3 Overview

Use the download button to access the SQ2364EES-T1_GE3 schematic symbol, PCB footprint, and 3D model.
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