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SSM2019BNZ - Analog Devices

Description: SSM2019BNZ, Audio Amplifier Class-AB mono 74dB +85 °C 8-Pin PDIP

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SSM2019BNZ - Analog Devices PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-PDIP_2020
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SSM2019BNZ - Analog Devices  - 3D model - Dual-In-Line Packages - 8-PDIP_2020
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SSM2019BNZ Details

  • Manufacturer Part Number:

    SSM2019BNZ

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    N-8

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Bandwidth-Nom:

    200 kHz

  • Consumer IC Type:

    CLASS AB AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e3

  • Length:

    9.88 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.33 mm

  • Supply Current-Max:

    7.5 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    BIPOLAR

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

SSM2019BNZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the SSM2019BNZ involves keeping the input and output traces short and symmetrical, using a solid ground plane, and placing the device close to the power supply. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source (e.g., 5V or 15V), and decouple it with a 10uF capacitor to ground. The VEE pin should be connected to a negative voltage source (e.g., -5V or -15V) or ground, depending on the application.
  • The maximum power dissipation of the SSM2019BNZ is 1.4W. To ensure reliable operation, the device should be operated within the recommended operating conditions, and proper heat sinking should be implemented if necessary.
  • The SSM2019BNZ is rated for operation from -40°C to +85°C. While it can operate in high-temperature environments, the device's performance and reliability may degrade above 70°C. Proper heat sinking and thermal management are crucial in high-temperature applications.
  • Common issues with the SSM2019BNZ can be troubleshooted by checking the PCB layout, ensuring proper biasing and decoupling, and verifying the input and output impedance matching. Additionally, checking for oscillation or instability can be done by monitoring the output waveform and adjusting the compensation components as needed.

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SSM2019BNZ Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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Part Image SSM2019BN Analog Devices Inc

Audio Preamplifier, 1 Channel(s), 1 Func, Bipolar, PDIP8